Abstract:The increasing demand for designing and manufacturing micro parts with high quality comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that, the generation and evolution of defects are mainly, responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered beneficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.

Quasicontinuum Method Simulation of Nanometric Cutting of Single Crystal Copper

Nanoscale cutting simulation of single crystal copper based on multiscale method

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Quasicontinuum Simulation of Effect of Crystal Orientation and Cutting Direction of on Nanometric Cutting of Single Crystal Copper

Quasicontinuum Simulations of Nano-cutting Process

Multiscale Simulation of Nanometric Cutting of Single Crystal Copper and Its Experimental Validation

Multiscale simulation on nanometric cutting of single crystal copper

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

Multiscale Simulation of Nanometric Cutting of Single Crystal Cu Based on Bridging Domain Method

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING CHARACTERISTICS OF SINGLE CRYSTAL Cu

Multiscale Simulation of Nanometric Cutting of Single Crystal Copper—effect of Different Cutting Speeds

Molecular Dynamics Simulation of Nanometric Cutting of Polycrystalline Copper

Multiscale Simulation of Indentation, Retraction and Fracture Processes of Nanocontact

Large Scale Molecular Dynamics Study of Nanometric Machining of Copper

Nanoindentation simulation on single crystal copper by quasi-continuum method

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

Multi-scale Numerical Analysis and Experimental Verification for Nano-Cutting

MOLECULAR DYNAMICS SIMULATIONS OF NANOMA-CHINING MECHANISM AND THERMAL EFFECTS OF SINGLE CRYSTAL Cu

Multiscale Simulations of Nanoindentation and Nanoscratch of Single Crystal Copper

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Effects of Cutting Parameters on the Subsurface Damage of Single Crystal Copper During Nanocutting Process