Heat Dissipation Design of Sub-module in Modular Multilevel Converter

吕栋,申斐斐,施科研,陈敏,徐德鸿
DOI: https://doi.org/10.13234/j.issn.2095-2805.2012.2.42
2012-01-01
Abstract:Based on the loss analysis of sub-module in modular multilevel converter,the thermal resistance model of heat sink was analyzed from heat transferring.The heat sink of sub-module in 500kVA modular multilevel converter with three phases was designed.Additionally,the simulation in Ansys software verified the result of heat sink design,which was verified by experiment finally.
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