Dissipation Analysis of MMC-HVDC Based on Junction Temperature Feedback Method

屠卿瑞,徐政

2012-01-01

Abstract:We evaluated losses of the converter power of modular multilevel converter { MMC） by a junction temperature feedback methr~d. Using the data provided by the manufacturer, we acquired the characteristic of semiconductor device, and calculated both the switching and conduction losses with the real-time voltage and current waveforms, which were derived from the detailed PSCAD/EMTDC model. Moreover, we applied the thermal circuit model to estimate the average junction temperatures of the semiconductors, and investigated the converter valve losses with different heat sink temperatures. Power losses evaluation results demonstrate that the power loss of MMC topology is lower than 1~ of the rated power, which is lower than that of the 2-level or 3-level VSC topologies.