The Structure of the Underpotential Deposition of Copper on to Pt(111) in the Presence of Chloride Anions: a LEED Structure Analysis

H Bludau,K Wu,MS Zei,M Eiswirth,H Over,G Ertl
DOI: https://doi.org/10.1016/s0039-6028(97)01061-3
IF: 1.9
1998-01-01
Surface Science
Abstract:The underpotential deposition (UPD) of copper on to Pt(111) in the presence of chloride anions was studied by full-dynamical LEED-intensity analyses. A deformed (4×4) LEED pattern was observed at an emersion potential of 0.36V vs. Ag/AgCl, right in between the two characteristic and well-separated peaks of the cyclic voltammogram (CV). Corresponding LEED intensity measurements and simulations of the integral-order beams indicate that the UPD of Cu forms a single pseudomorphic Cu layer on Pt(111).
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