Optimization of LTCC Multilayer Interconnect Substrate Process

WANG Hao-qin,ZENG Zhi-yi,WEI Xu-bo,XU Zi-qiang
2008-01-01
Abstract:Low temperature cofired ceramic (LTCC) possesses a great number of advantages. It is used as IC substrate plate where passive devices may be embedded. LTCC is widely used in military, astronavigation, automobile, microwave and radio frequency communication. This paper deals with the manufacture and the process optimization of LTCC.
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