Abstract:The special mixed boundary value problem in which a debonded conducting rigid line inclusion is embedded at the interface of two piezoelectric half planes is solved analytically by employing the 8-D Stroh formalism. Different from existing interface insulating crack model and interface conducting rigid line inclusion model, the presently analyzed model is based on the assumption that all of the physical quantities, i.e., tractions, displacements, normal component of electric displacements and electric potential, are discontinuous across the interface defect. Explicit solutions for stress singularities at the tips of debonded conducting rigid line inclusion are obtained. Closed form solutions for the distribution of tractions on the interface, surface opening displacements and jump in electric potential on the debonded inclusion are also obtained, in addition real form solutions for these physical quantities are derived. Various forms of interface defect problems encountered in practice are solved within a unified framework and the stress singularities induced by those interface defects are discussed in detail. Particularly, we find that the analysis of interface cracks between the embedded electrode layer and piezoelectric ceramics can also be carried out within the unified framework.

Interface crack problems of a laminated piezoelectric plate

Exact Solution to the Problem of A Half-Plane Crack in A Transversely Isotropic Piezoelectric Body Subjected to Antisymmetric Tangential Point Forces

On interface crack in laminated anisotropic medium

Wave scattering from an interface crack in multilayered piezoelectric plate

Electroelastic analysis of an interface anti-plane shear crack in a layered piezoelectric plate

A Cracked Piezoelectric Material under Generalized Plane Electromechanical Impact

Impact interfacial fracture for piezoelectric ceramic

Dynamic Response of a Crack in a Functionally Graded Interface of Two Dissimilar Piezoelectric Half-Planes

Multi-interface Cracks in a Piezoelectric Layer Bonded to Two Half-Piezoelectric Spaces under Anti-Plane Shear Loading

An Interface Crack Between Two Dissimilar Functionally Graded Piezoelectric/Piezomagnetic Material Half Infinite Planes Subjected To The Harmonic Anti-Plane Shear Stress Waves

Moving Crack at the Interface between Functionally Graded and Piezoelectric Layers

Interface crack in bi-piezothermoelastic media and the interaction with a point heat source

On the Study of Interface Crack in Layered Piezoelectric Structures

Dynamic Behavior of Two Unequal Parallel Permeable Interface Cracks in a Piezoelectric Layer Bonded to Two Half Piezoelectric Materials Planes

Antiplane interface crack between two bonded dissimilar piezoelectric layers

Mode-III Interface Edge Crack Between Two Bonded Quarter-Planes of Dissimilar Piezoelectric Materials

Exact solution for mixed boundary value problems at anisotropic piezoelectric bimaterial interface and unification of various interface defects

A crack with surface effects in a piezoelectric material

Surface Cracking of a Piezoelectric Strip Bonded to an Elastic Substrate (mode I Crack Problem)

Analysis of intensity factors of interface crack in piezoelectric bimaterials

Out-of-plane Interface Cracks in Dissimilar Piezoelectric Materials