Moving Crack at the Interface between Functionally Graded and Piezoelectric Layers

Guo Yubin,Li Xing
DOI: https://doi.org/10.3969/j.issn.0253-2328.2008.03.001
2008-01-01
Abstract:The behavior of moving crack at the interface between functionally graded and piezoelectric layers is investigated under the assumption that the effect of the crack surface overlapping very near the crack tips is negligible.Fourier transforms are used to reduce the problem to the solution of a pair of dual integral equations,which are then reduced to a Fredholm integral equation of second kind by the Copson-Sih method,and anti-plane displacement,electric potential and stress are obtained.At last,the influences of graded parameter,the moving velocity of the crack and geometrical size on dynamic stress intensity factor are analyzed.
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