Abstract:This paper deals with a case study for the piezoelectric materials suddenly exposed to an environmental medium of different temperature. The problem is idealized to a plate containing an edge crack or an embedded crack. The stress and electric displacement histories in an uncracked plate are calculated. These stresses and electric displacements are then added to the crack surface tractions and electric displacements with opposite sign to formulate a mixed boundary value problem. The cracking problem is thus reduced to a singular integral equation of Cauchy type, which is then solved numerically. Both impermeable crack assumption and permeable crack assumption are considered. The results for stress and electric displacement intensity factors are computed as a function of normalized time and crack size. Lower bound solutions are obtained for the maximum thermal shock that the material can sustain Without catastrophic failure according to the two distinct criteria: (i) The maximum local tensile stress equals the tensile strength of the medium. (ii) The maximum stress intensity factor for the pre-existing representative crack equals the fracture toughness of the medium. The parameters that control the transient thermal stress and electric displacement are also identified. The method can be used to explore susceptibility to thermal fracture in piezoelectric materials containing pre-cracks.

Impact interfacial fracture for piezoelectric ceramic

Numerical Analysis for A Crack in Piezoelectric Material under Impact

Higher Order Asymptotic Solution for an Interfacial Crack in Piezoelectric Bimaterial under Impact

Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts

Interface crack problems of a laminated piezoelectric plate

Coupled Electromechanical Fracture of Piezoelectric Ceramics Subjected to Transient Thermal Loads

On Branched Interface Cracks Between Two Piezoelectric Materials

Transient Response of Multiple Interface Cracks in Fine-Grained Coating Composite Structures under Impact Loading

A Cracked Piezoelectric Material under Generalized Plane Electromechanical Impact

BOUNDARY INTERGRAL-DIFFERENTIAL EQUATIONS FOR INTERFACIAL CRACKS IN THREE DIMENSIONAL PIEZOELECTRIC MEDIA

Nonlinear electromechanical interfacial fracture for piezoelectric materials

A crack with surface effects in a piezoelectric material

Surface Thermal Shock Fracture of a Semi-Infinite Piezoelectric Medium (poling Axis Parallel to the Crack Plane)

Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts

Thermal shock fracture of piezoelectric materials

Dynamic Response of a Crack in a Functionally Graded Interface of Two Dissimilar Piezoelectric Half-Planes

Multi-interface Cracks in a Piezoelectric Layer Bonded to Two Half-Piezoelectric Spaces under Anti-Plane Shear Loading

Anti-plane Shear Crack Normal to and Terminating at the Interface of Two Bonded Piezoelectric Ceramics

FRACTURE OF A PIEZOELECTRIC MATERIAL STRIP UNDER STEADY STATE THERMAL LOAD

Exploring the Dynamic Fracture Performance of Epoxy/cement Based Piezoelectric Composites with Complex Interfaces

Multiple Surface Cracking of A Piezoelectric Layer Bonded to an Elastic Substrate under Dynamic Anti-Plane Electromechanical Impacts