Lifetime Analysis of Lead-Free Ball Grid Array Solder Joints under Random Vibration

王文,刘芳,尤明懿,孟光

DOI: https://doi.org/10.16183/j.cnki.jsjtu.2011.09.021

2011-01-01

Abstract:Four groups of random vibration tests of solder joints were conducted with different power spectral density（PSD） of in-put acceleration.Proportional hazards model（PHM） was used to evaluate the effect of PSD of in-put acceleration on the solder joints＇ life span.The mean-time-to-failure（MTTF） and the failure probability density function（PDF） estimated from the PHM agree well with the experimental data,and this validates the effectiveness of the PHM.By the curve of the MTTF s,it can be observed that the MTTF1 800 s when the amplitude of PSD was greater than 60 m2/s3,and this demonstrates that the lead-free solder joints are very sensitive to random vibration loading.Finally,the estimated lifetime of MTTF was integrated with the Miner＇s law for cumulative damage model of lead-free solder joints.