A Digital-Optical System-on-package Module Architecture for High Performance Multiprocessors

GK Chang,D Guidotti,ZR Huang,FH Liu,YJ Chang,JJ Yu,RR Tummala
DOI: https://doi.org/10.1109/leos.2004.1363372
2004-01-01
Abstract:This paper reports on the progress toward implementing optical-digital building blocks necessary to accomplish a system-on-package module architecture for high-performance multiprocessors. In this architecture, the memory access delay (MAD) bottleneck is minimized by using a 3-D distributed shared memory field in which high speed optical interconnects deliver data to and from each processor in a cluster to each memory controller/MX-DMX in the field, each memory controller being connected to a small cluster of main memory via a short, high aggregate speed copper bus that essentially matches the intrinsic MAD of the DRAM chip.
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