Abstract:Optical communication is distinguished for its enormous interconnect capacity over long distance. As the cost of optical components drops, high bandwidth optical systems were successfully employed into local area network and computer racks because electrical counterparts are not able to deal with the data rate demands for these applications. With the popularity of multi-core CPU in High Performance Computers, the board-to-board interconnects exclusive based on electrical technology in backplane applications become insufficient because of not only bandwidth crises, but also wiring congestions. Many researches have projected that the progress of optical technology will further push down the boundary demarcating electrical and optical domains in the interconnect hierarchy. Accordingly, backplane or even board-to-board level interconnects will benefit from the complement of optical interconnect. From architecture point of view, an optical bus implementation of the optical interconnect has the potential advantage of both huge bandwidth and elimination of wiring congestion. In contrast, optical waveguide and free-space interconnects although provide high bandwidth capacity, are essentially point-to-point technology which requires routing to a central switch on the backplane. The centralized approach that was based on substrate guided optical interconnects is the only way known that fulfills a uniform fan-out for different nodes in a bus architecture, which allows medium sharing among nodes. In this dissertation, innovative bit-interleaved optical backplane bus architecture is created based on centralized substrate-guide optical interconnect, which allows the tremendous bandwidth capacity to be shared by retaining the share bus architecture. Therefore, a secure and reliable high speed transmission channel could be established by distributing copies of confidential information separately. The feature provided by this innovative design cannot be fulfilled using electrical interconnects or other optical point-to-point technology without causing wiring congestions. In this dissertation, the optical characteristics of the centralized optical bus such as bandwidth and alignment tolerance are analyzed so that multi-channel implementation are successful on the fabricated optical interconnect layer. A 3-board-16-channel computer server using optical backplane board demonstrator using centralized optical bus was built upon the simulation, design and packaging work.

Bandwidth-enhanced Photopolymer Waveguide Hologram-Based Optical Backplane

High Performance Multiprocessor Computing System Using Optical Centralized Shared Bus

Centralized Optical Backplane Bus Using Holographic Optical Elements for High Performance Computing

15-Gb/s Bit-Interleaved Optical Backplane Bus Using Volume Photopolymer Holograms

Bit-Interleaved Optical Bus for High-Speed Secure Multi-Board System

A 2-Gb/s/pin Source Synchronous CDMA Bus Interface with Simultaneous Multi-Chip Access and Reconfigurable I/O Capability

A 40 Gb/s Optical Bus for Optical Backplane Interconnections

Optoelectronic packaging for 16-channel optical backplane bus with VHOEs

3.2Gbps Multi-Channel Optical Backplane Bus Demonstrator Using Photopolymer Volume Gratings

Reconfigurable intelligent optical backplane for parallel computing and communications

RCBus: Row-column bus topology for optical network-on-chip

Wavelength division multiplexers/demultiplexers for optical interconnects in massively parallel processing

A Digital-Optical System-on-package Module Architecture for High Performance Multiprocessors

Low Cost Virtual Parallel Optical Fiber Pci Link

High-Throughput Optoelectronic Interconnect for Holographic Memory Devices

A Parallel Low Latency Bus on Chip for Packet Processing MPSoC

Unified Inter- and Intra-chip Optical Interconnect Networks

A Hierarchical Dataflow-Driven Heterogeneous Architecture for Wireless Baseband Processing

Soft-Lithography-Based Inter-Chip Optical Interconnects

A Hierarchical Hybrid Optical-Electronic Network-on-Chip

A New Optical Network-on-Chip Architecture for Chip Multiprocessor