Abstract:The evolution of microstructure in Cu/In-48Sn/Cu solder bump interconnects at a current density of 0.7 x 10(4) A/cm(2) and ambient temperature of 55 degrees C has been investigated. During electromigration, tin (Sn) atoms migrated from cathode to anode, while indium (In) atoms migrated from anode to cathode. As a result, the segregation of the Sn-rich phase and the In-rich phase occurred. A Sn-rich layer and an In-rich layer were formed at the anode and the cathode, respectively. The accumulation rate of the Sn-rich layer was 1.98 x 10(-9) cm/s. The atomic flux of Sn was calculated to be approximately 1.83 x 10(13) atoms/cm(2)s. The product of the diffusivity and the effective charge number of Sn was determined to be approximately 3.13 x 10(-10) cm(2)/s. The In-48Sn/Cu IMC showed a two layer structure of Cu-6(Sn, In)(5), adjacent to the Cu, and Cu(In, Sn)(2), adjacent to the solder. Both the cathode IMC and the anode IMC thickened with increasing electromigration time. The IMC evolution during electromigration was strongly influenced by the migration of Cu atoms from cathode to anode and the accumulation of Sn-rich and In-rich layers. During electromigration, the Cu(In, Sn)(2) at the cathode interface thickened significantly, with a spalling characteristic, due to the accumulation of In-rich layer and the migration of Cu atoms-while the Cu(In, Sn)(2) at the anode interface reduced obviously, due to the accumulation of Sn-rich layer. The mechanism of electromigration-induced failure in Cu/In-48Sn/Cu interconnects was the cathode Cu dissolution-induced solder melt, which led to the rapid consumption of Cu in the cathode pad during liquid-state electromigration and this finally led to the failure. (C) 2016 Elsevier B.V. All rights reserved.

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