Development of Organosilicon Adhesive with Low Decomposition and High Temperature Resistance

Wan-rong CAO,Mei-sheng CAO,Yin-ping YANG,Yong-zhong BAO
DOI: https://doi.org/10.3969/j.issn.1009-9239.2010.03.003
2010-01-01
Abstract:A type of silicone resin adhesive was synthesized by a batch polycondensation,with dialkoxylsilane and trialkoxysilane as monomers and the ratio of R/Si as 1 to 1.2.The product was analyzed by FTIR,TGA and research on the mechanical properties.The results indicate that the adhesive has high heat resistance and little resolvent property and can compare with KR-242A to a certain degree.
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