FABRICATION AND CHARACTERIZATION OF FUNCTIONALLY GRADED Ni–Ti MULTILAYER THIN FILMS

H. Tian,D. Schryvers,K. P. Mohanchandra,G. P. Carman,J. Van Humbeeck
DOI: https://doi.org/10.1142/s1793604709000570
IF: 1.4901
2009-01-01
Functional Materials Letters
Abstract:A functionally graded multilayer Ni – Ti thin film was deposited on a SiO 2/ Si substrate by d.c. sputtering using a ramped heated Ni – Ti alloy target. The stand-alone films were crystallized at 500°C in vacuum better than 10-7 Torr. Transmission electron microscopy micrographs taken along the film cross section show two distinct regions, thin and thick, with weak R and B2 phases, respectively. The film compositions along the thickness were measured and quantified using the standard-less EELSMODEL method. The film deposited during the initial thermal ramp (thin regions) displays an average of 54 at.% Ni while the film deposited at a more elevated target temperature (thick regions) shows about 51 at.% Ni .
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