Analysis of Surface Morphology and Chemical Composition of InAs Single Crystal Substrate
HU Wei-jie,ZHAO You-wen,DUAN Man-long,WANG Ying-li,WANG Jun
DOI: https://doi.org/10.3969/j.issn.1000-985X.2010.04.011
2010-01-01
Abstract:InAs single crystal polished wafers were analyzed by using atomic force microscope( AFM) ,Xray photoelectron spectroscopy( XPS) and Auger electron spectroscopy( AES) ,respectively. Depending on the chemical mechanical polishing process and cleaning procedure,InAs single crystal polished wafers exhibit different surface composition and large surface roughness. Under normal circumstance,InAs single crystal polished wafer surface oxide layer contains In2O3,As2O5,As2O3 and elements As. With the volatile of element As,the surface stoichiometry becomes indium-rich. After appropriate chemical treatment,the wafer surface chemical composition is controlled and the surface roughness is reduced. In this way,EPI-Ready InAs single crystal substrates required by epitaxial growth is obtained.