Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb–Ti–Si based ultrahigh temperature alloy

Haisheng Guo,Xiping Guo
DOI: https://doi.org/10.1016/j.scriptamat.2010.12.008
IF: 6.302
2011-01-01
Scripta Materialia
Abstract:Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 degrees C with withdrawal rates varying from 2.5 to 100 mu m s(-1). The directionally solidified microstructure was composed of primary suicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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