Electrodeposition and Characterization of Assembly of Sn on Cu Nanorods for Li-ion Microbattery Application

Dongdong Jiang,Haiying Tian,Chenchen Qiu,Xiaohua Ma,Yanbao Fu
DOI: https://doi.org/10.1007/s10008-010-1251-1
IF: 2.747
2010-01-01
Journal of Solid State Electrochemistry
Abstract:Assembly of Sn on Cu Nanorods as anode for Li-ion microbatteries was prepared by a two-step electrodeposition design. Firstly, Cu nanorods arrays were grown on copper substrate by anodic aluminum oxide template-assisted growth method. Then, Sn was deposited onto Cu nanorods arrays by galvanostatic deposition. X-ray diffraction and scanning electron microscopy measurements reveal that Cu nanorod arrays are covered with Sn. Electrochemical performances of prepared electrodes were evaluated by charge/discharge cycle measurement. The assembly of Sn on Cu nanorods electrode exhibited highly reversible specific capacity and superior capacity retention resulting from the three-dimensionally nano-architectured design, which exhibits a large surface area, shortened Li-ion diffusion distance, Cu–Sn alloying, and can accommodate the volume expansion of Sn during cycling. Deposition time is an important parameter for fabricating the assembly of Sn on Cu nanorods electrode with suitable structure and morphology.
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