Abstract:The precise extraction of a thin slice (lamellae) from nano electronic devices using a focused ion beam (FIB) is crucial for transmission electron microscopy analysis, but it remains a challenge for 100 nm and beyond scale device components. In this study, we introduce a new method that utilizes the device's own features as markers during FIB thinning process by continuously monitoring the intermediate structures with secondary electron scanning electron microscopy (SE-SEM) imaging. This allows for the targeted extraction of the desired device component with high precision. We successfully demonstrate the effectiveness of this approach by extracting lamellae from 100 nm length channel in arrayed carbon nanotube film field-effect transistors using FIB lift-out. Lay Description: In today's semiconductor industry, nanoscale and even atomic-scale investigation of the processing and product quality of nanodevices is essential, for which the combination of focused ion beam (FIB) and transmission electron microscope (TEM) is a commonly used tool. A key requirement is to ensure the TEM examined device components are precisely defined during the FIB process, which is becoming a challenge particularly for 100 nm scale (and beyond) nanodevices. In this study, the authors propose and further demonstrate a self-marked method that enables the feasibility of extracting sub-100 nm components of nanodevices (using the state-of-the art carbon nanotube transistor as a demo) using FIB, by continuously monitoring intermediate structures with secondary electron scanning electron microscopy (SE-SEM) imaging. This article is protected by copyright. All rights reserved.

A novel harmless trimming for micro-device with defects and particles in arbitrary geometry by fine milling of focused ion beam

Self-marked preparation of site-specific transmission electron microscope lamellae of nanodevices using focusing ion beam technique.

Large-Area and High-Precision Milling of Focused Ion Beam Based on the Integration of Nanoscale Machine Vision and Compensation Control

Experimental Study of Three-Dimensional Microfabrication by Focused Ion Beam Technology

Investigation of 3D microfabrication characteristics by focused ion beam technology in silicon

A trimming method for MEMS gyroscopes by focused ion beam etching

Focused Ion Beam Assisted Interface Detection for Fabricating Functional Plasmonic Nanostructures

A Review of Focused Ion Beam Sputtering

Investigation of direct milling of micro-optical elements with continuous relief on a substrate by focused ion beam technology

Adaptive Processing Strategy of Pulse Ion Beam for Sub-nanometer Precision Optical Components

A Study on Focused Ion Beam (FIB) Milling Machining and Fabrication Technology of Nano-Scale Diamond Tool for Machining Fine-Patterns in a Free-Form Surfaces

Post-Processing Trimming of Silicon Photonic Devices Using Femtosecond Laser.

Focused Ion Beam Built-Up on Scanning Electron Microscopy with Increased Milling Precision

Focused Ion Beam Machining And Deposition

Box 9: Integrated Circuit Chip Modification Using Focused Ion Beams

Focused-ion-beam stress introducing technology for micro/nano-fabrications

Experimental study of microcylindrical lenses fabricated using focused-ion-beam technology

Rapid Focused Ion Beam Milling Based Fabrication of Plasmonic Nanoparticles and Assemblies Via "sketch and Peel" Strategy.

Development of a laser-focused ion beam combination machine

Strain analysis in MEMS/NEMS structures and devices by using focused ion beam system

Microlens Array Fabrication on WC Mold Using EDM Milling with in Situ Electrode Trimming