Abstract:We have investigated the rate sensitivity of flow stress and the extent of strengthening in polycrystalline copper containing different volume fractions of nano-sized twins, but having the same average grain size. The specimens were produced by pulsed electrodeposition, wherein the concentration of twins was varied systematically by varying the processing parameters. Depth-sensing instrumented indentation experiments performed at loading rates spanning three orders of magnitude on specimens with the higher density of twins (twin lamellae width ∼20nm) revealed an up to sevenfold increase in rate-sensitivity of hardness compared to an essentially twin-free pure Cu of the same grain size. A reduction in twin density for the same grain size (with twin lamellae width ∼90nm) also resulted in a noticeable reduction in rate-sensitivity and hardness. The presence of a high density of nano-scale twins is also seen to impart significant hardness, which is comparable to that achieved in nano-grained Cu. Post-indentation analyses of indented Cu with nano-scale twins in the transmission electron microscope reveal deformation-induced displacement of coherent twin boundaries (CTBs), formation of steps and jogs along CTBs, and blockage of dislocations at CTBs. These processes appear to significantly influence the evolution of thermal activation volume for plastic flow which is some three orders of magnitude smaller than that known for microcrystalline Cu. Transmission electron microscopy also reveals CTBs with a high density of dislocation debris and points to the possibility that displaced CTBs may serve as barriers to dislocation motion and that they may also provide sources for dislocation nucleation, especially near stress concentrations, very much like grain boundaries. Possible consequences of these trends for deformation are explored.

Microstructure and Tensile Strength of Cu with Nano-Scale Twins

Tensile Properties of Copper with Nano-Scale Twins

ENHANCED TENSILE DUCTILITY IN AN ELECTRODEPOSITED CU WITH NANO-SIZED GROWTH TWINS

In Situ Nanomechanical Testing of Twinned Metals in a Transmission Electron Microscope

Two softening stages in nanotwinned Cu

Modeling Grain Size Dependent Optimal Twin Spacing for Achieving Ultimate High Strength and Related High Ductility in Nanotwinned Metals

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

The Origin of the Ultrahigh Strength and Good Ductility in Nanotwinned Copper

Strain Hardening and Large Tensile Elongation in Ultrahigh-Strength Nano-Twinned Copper

Enhanced Tensile Ductility and Toughness in Nanostructured Cu

Mechanical Behavior of an Electrodeposited Nanostructured Cu with A Mixture of Nanocrystalline Grains and Nanoscale Growth Twins in Submicrometer Grains

Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films

Bulk Nanostructured Cu with High Strength and Good Ductility

Ultrahigh Strength and High Electrical Conductivity in Copper.

A Constitutive Description of the Yield Strength and Strain Hardening Behaviors of Nano-Twinned Metals

Revealing the Maximum Strength in Nanotwinned Copper

Tensile Mechanical Properties of Nano-Twinned Copper Containing Silver Inclusions

Microsample tensile testing of nanocrystalline copper

Nano-Sized Twins Induce High Rate Sensitivity of Flow Stress in Pure Copper

Persistence of twins in highly nanotwinned copper under intense shear strain

Electrodeposition of Cu nanowires with ultrahigh-density twin boundaries: An electrochemical perspective on nanotwinning