Researches on Laser Cladding Strengthening Technology on Copper Crystallizer Surface and Comparison with Electroplating Technology

Gao Sen,Jia Zhiguo,Deng Qilin

DOI: https://doi.org/10.3969/j.issn.1009-279X.2013.01.008

2013-01-01

Abstract:Ni based alloy and Co based alloy have been successfully cladded on the crystallizer Cu alloy by powder fed laser cladding,whose microstructure are fine,dense and defect-free.The metallurgical bonding layer is formed at the bottom of the laser cladding layer.It is found that the average micro-hardness of Ni based and Co based cladding layer separately is 672.3 HV0.5 and 604 HV0.5 which is about 2.6 times and 2.4 times of Ni based electroplated layer,about 6.5 times and 6.2 times of Cu substrate.Although electroplating is the main strengthening technique on the copper crystallizer surface,electroplated layer micro-hardness will become low with the temperature becoming high.Through heat shock test the electroplated layer microstructure become large and its micro-hardness also become much lower than before,while it is little influence on laser cladding laser.So laser cladding is the one of effective methods of surface strengthening on the copper crystallizer,and can replace electroplating technique.