Conditions for pack codeposition of Al and Hf on nickel-base superalloys

Z.D. Xiang,P.K. Datta
DOI: https://doi.org/10.1016/S0257-8972(03)00790-4
IF: 4.865
2004-01-01
Surface and Coatings Technology
Abstract:The following study focuses on identifying the conditions for codepositing Hf and Al by the pack cementation process to form diffusion coatings on nickel-base superalloys to enhance their high temperature sulfidation/corrosion resistance. Thermochemical calculations were carried out for the pack series Hf–CrCl3·6H2O–Al2O3 with or without elemental Al added. The results obtained were used to identify possible pack compositions suitable for the intended codeposition process by comparing the calculated partial pressures of Hf-, Al- and Cr-chloride vapour species generated at high temperatures. Based on the results of thermochemical calculations, a series of coating deposition experiments were undertaken, which confirmed that codeposition of Al and Hf is possible at 1100 °C in packs of appropriate compositions. It was inferred from the results of both thermochemical calculations and coating deposition experiments that HfCl4 may not be considered as the depositing species for releasing Hf at the substrate surface and that the deposition tendency of these packs can be assessed by comparing the calculated partial pressures of HfCl3, AlCl and CrCl. When the partial pressure of CrCl is far higher than those of HfCl3 and AlCl, the packs have a tendency to deposit only Cr. When the partial pressure of CrCl is lower than that of either HfCl3 or AlCl, and also when the partial pressures of HfCl3 and AlCl is within approximately one order of magnitude, codeposition of Hf and Al may occur within the packs. Under the conditions suitable for codepositing Hf and Al, coatings formed predominantly through the outward Ni diffusion process. The microstructure of coatings depended strongly on the pack composition. It is expected that the deposition parameters, such as pack composition and deposition temperature may be usefully utilised to influence the mechanism and kinetics of the codeposition process and hence to effectively control the microstructure of the coating formed as a result.
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