Design of Low Dielectric Glass+ceramics for Multilayer Ceramic Substrate

JH JEAN,TK GUPTA
DOI: https://doi.org/10.1109/96.330424
1994-01-01
Abstract:Compositional design and properties of a low dielectric constant glass+ceramics, containing borosilicate glass, high silica glass and alumina, for multilayer ceramic substrates are described. The new low dielectric system can be densified at below 1000/spl deg/C in air, allowing high electrical conductivity metallization including Au and Ag-Pd. Compositions with tailor-made properties are designed according to a working model based upon mixing rule, and validated with experimental results. Compositions with a thermal expansion coefficient compatible with Si and GaAs, and a dielectric constant in the range of 4-4.5 and 5-6, respectively, are developed.< >
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