Deformation Behavior and Microstructural Evolution During the Semi-Solid Compression of Al–4Cu–Mg Alloy

YL Lu,MQ Li,WC Huang,HT Jiang

DOI: https://doi.org/10.1016/j.matchar.2005.01.013

2007-01-01

Abstract:The effects of the process parameters, including deformation temperature and strain rate, on the deformation behavior and microstructure of an Al–4Cu–Mg alloy, have been investigated through isothermal compression. Experiments were conducted at deformation temperatures of 540 °C, 560 °C, and 580 °C, strain rates of 1 s−1, 1×10−1 s−1, 1×10−2 s−1, and 1×10−3 s−1, and height reductions of 20%, 40%, and 60%. The experimental results show that deformation temperature and strain rate have significant effect on the peak flow stress. The flow stress decreases with an increase of deformation temperature and/or a decrease of the strain rate. Above a critical value of the deformation temperature, the flow stress quickly reaches a steady value. Experimental materials A and B have equiaxed and irregular grains, respectively, prior to deformation. The microstructures vary with the process parameters in the semi-solid state. For material B, the irregular grains transform to equiaxed grains in the process of semi-solid deformation, which improves the deformation behavior.