Preparation and Physicochemical Properties of Hollow Glass Microspheres Thermal Insulation Board

SONG Xiaorui,YANG Hui

DOI: https://doi.org/CNKI:11-2310/TQ.20120331.1118.018

2012-01-01

Abstract:The rigid insulation boards were heat–treated at 520 ℃ for 30 min by hollow glass microspheres(HGM) mixed with a saturated solution of aluminum nitrate.The thermal conductivity,compressive strength and combustion performance of insulation board were tested,and impacts of the particle density and average particle size of HGM on thermal conductivity of insulation board were discussed.The results show that the thermal conductivity of insulation board decreases with HGM to lower particle density.When the particle density of HGM is 0.18 g/cm3,the thermal conductivity of insulation board is 0.072 W/(m?K),the compressive strength is 2.2 MPa.When the average particle size of HMG less than 30 μm,the measured thermal conductivity of the insulation board is close to that from calculation of Dul'nev's prediction equations.HGM insulation board meets the requirements of building insulation and fire protection because its burning behavior meets the criterion of level A1.