Excimer laser marking − A precise patterning technique for material surfaces
Jingzhen Shao,Xu Liang,Ying Lin,Qihui Shen,Jiacheng Ren,Jinliang Han
DOI: https://doi.org/10.1016/j.optlastec.2024.110974
IF: 4.939
2024-04-11
Optics & Laser Technology
Abstract:Laser marking offers precise, consistent, and permanent markings, making it an ideal choice for various applications that require accurate identification. The excimer laser, a type of pulsed gas laser that operates in the ultraviolet spectrum, offers unique advantages. Its short wavelength allows the emitted ultraviolet light to be absorbed by most materials, and its penetration depth is extremely low, causing minimal damage to the interior of the material. Furthermore, the excimer laser's high photon energy enables the creation of extremely fine features, leading to unparalleled precision in machining. Based on the photochemical mechanism, excimer laser marking produces minimal heat-affected zones, preventing thermal damage and ensuring crisp, clear edges to markings. This makes it particularly well-suited for the precise patterning needed in surface marking. This paper reviews excimer laser marking techniques, including laser direct ablation marking, diffraction marking, laser induced chemical reactions marking and laser implantation marking. Each technique is explained in detail, highlighting its unique mechanisms, preparation process and outlining potential application prospects. In summarizing the capabilities of excimer laser marking technology, this paper also briefly explores future research directions, suggesting promising advancements that could further enhance the technology's utility in industrial and manufacturing settings.
optics,physics, applied