Motion stages for electronic packaging design and control

Han Ding,Zhenhua Xiong
DOI: https://doi.org/10.1109/MRA.2006.250562
2006-01-01
Abstract:This paper reviews the design and control progress of motion stages for electronics packaging, specifically, for wire bonding, due to its characteristics of high acceleration and high accuracy. The paper also introduces both conventional serial-type and new parallel-type motion stages. Several modeling techniques and many high performance control schemes are also reviewed
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