Abstract:Diamond-incorporated copper metal matrix layers were fabricated on brass substrates by using electrodeposition technology in this study. To improve the adhesion of the composite coatings on the brass substrate, a plated copper was applied as the interlayer between the multilayers and the substrate. The surface morphologies of the interlayer and the diamond-incorporated copper composite layers were studied by scanning electron microscopy. The effect of the copper interlayer on the incorporation and the distribution of the diamond content in the coatings was analyzed by surface roughness, electrochemical impedance spectroscopy, and cyclic voltammetry. The diamond content of the composite coating was measured by energy-dispersive X-ray. The film thickness was evaluated by the cross-sectional technique of focused ion beam microscopy. The element, composition, and crystallization direction of diamond with Cu matrix was measured by X-ray diffraction and transmission electron microscope. The adhesion of the multilayers was studied by scratch tests. The experiment results indicated that the diamond content and distribution of the coating were higher and more uniform with the Cu interlayer than that without one. The plated copper interlayer reduced the electrical double-layer impedance and enhanced the adsorption of diamond particles by the surrounding Cu ions, which promoted the diamond content in the composite coatings. The roughened surface caused by the plated Cu interlayer also improved the substrate's mechanical interlock with the composite coating, which contributed to the strong adhesion between them.

Electroless Deposition of Copper and Fabrication of Copper Micropatterns on CVD Diamond Film Surfaces

Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath

Diamond coatings on copper surfaces through interface engineering

Facile electroless copper plating on diamond particles without conventional sensitization and activation

Fabrication of Inlay Structure Diamond Films on Cu Substrate and the Evaluation of Adhesion Strength

Fabrication and Characterization of Cu-Diamond Composite Layer on CuCr0.5 Substrate

Direct Surface In-Situ Activation for Electroless Deposition of Robust Conductive Copper Patterns on Polyimide Film

Morphologies and structures of chemical vapor deposited diamond films and film-substrate interfaces

Preparation of Thick Cvd Diamond Film on Copper Substrate

In Situ Study of Copper Electrodeposition on A Single Carbon Fiber

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Fabrication of Conductive Copper Patterns Using Photocatalyst-activated Electroless Deposition

Nanoporous Copper Films with High Surface Area Formed by Chemical Dealloying from Electroplated CuZn Alloy

Effect of Boron Doping on Diamond Film and Electrochemical Properties of BDD According to Thickness and Morphology

Uniform Deposition of Chemical Vapor Deposition Diamond Films on Slender Tungsten Wires

Fabrication of Polycrystalline Diamond Films with Various Boron Doping Levels Deposited on WC–Co Electrode for Organic Pollutants Oxidation

Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

Fabrication and Functionalization of Tunable Nanoporous Copper Structures by Hybrid Laser Deposition and Chemical Dealloying

Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer

Surface Quality Improvement of B4c Particles for Electroless Copper Coating by Cu Activation and Oxidation Roughening Methods

Pd Nanoparticles As a New Activator for Electroless Copper Deposition