Online non-contact fault detection method of LED chip

Li Lian,Li Ping,Wen Yumei,Yin Fei
DOI: https://doi.org/10.3321/j.issn:0254-3087.2008.04.017
2008-01-01
Abstract:There is a lack of online test method for light-emitting diode(LED)chip during packaging process. An online non-contact fault detection method for LED chip in packaging is presented based on the photovoltaic effect in diode. By observing the current in the bonding lead frame of LED chip, which is induced by illuminating the chip, the LED chip function and its electric connection with the lead frame during packaging are detected. According to the structure of the LED lead frame, a method based on mutual induction is used to measure the photo-generated current without any contact with the LED chip. Experimental results show that LEDs with various colors could be detected online quickly and effectively.
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