Performance of Temperature-Controlled Electronic Heat Sink with Composite Paraffin/Expanded Graphite Phase Change Material

Gao Xue-nong,Li De-lun,Sun Tao,Cao Xin,He Wen-xiang
DOI: https://doi.org/10.3969/j.issn.1000-565X.2012.01.002
2012-01-01
Abstract:In order to improve the capability of heat shock resistance of electronic devices and ensure the working reliability and stability of the devices,composite paraffin/expanded graphite PCM(Phase Change Material) was prepared via the physical adsorption,with paraffin as a phase-change energy-storage material and with expanded graphite as a supporting matrix.Then,the product was applied to the thermal management of electronic devices,and the performance of a temperature-controlled heat sink with the composite PCM was investigated by the experiments on a simulated electronic chip.The results show that the thermal conductivity of the composite PCM containing 90% of paraffin is about 5 times that of pure paraffin(0.360 8 W/(m·K)),that the PCM filled in the heat sink effectively reduces the heating and cooling rates of the simulated electronic chip and prolongs the temperature-controlling time,and that,with the filling of the composite PCM in the heat sink,the temperature-controlling time of the chip at the heating powers of 15 and 20 W increases by 59% and 20%,respectively,which reduces the po-ssibility of burning out of electronic chips due to sharp temperature rise and provides the protection of electronic devices.
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