Research Progress of Spray Deposited High Si-Al Alloys for Electronic Packaging

LIU Wen-shui,WANG Ri-chu,PENG Chao-qun,MO Jing-yi,ZHU Xue-wei,PENG Jian
DOI: https://doi.org/10.19476/j.ysxb.1004.0609.2012.12.023
2012-01-01
The Chinese Journal of Nonferrous Metals
Abstract:The increasing development of modern microelectronic technology contributes to a higher demand for packaging materials.However,traditional ones can no longer work well for the modern packaging.A new series of spray deposition high Si-Al alloys developed for electronic packaging have attracted much attention for their remarkable comprehensive properties,such as combination of uniform small microstructure,low coefficient of thermal expansion,light mass and good machinability as well as easily coated and welded.The spray deposition process,microstructure,performance as well as research status were discussed,and the relevant problems and development tendency corresponding were also addressed.
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