Abstract:The traditional subtractive process to fabricate conductive patterns is environmentally harmful, wasteful, and limited in line width. The additive process, including direct printing of conductive paste or ink, direct printing of catalytic ink, laser-induced forward transfer, etc., can solve these problems. However, the current additive process also faces many difficulties such as low electrical and adhesion properties, low pattern thickness, high cost, etc. Benzotriazole (BTA), as widely used corrosion inhibitor, can be adsorbed onto a copper surface. The electroplated copper film on BTA-adsorbed copper foil shows poor adhesion. On the basis of this phenomenon, a novel template transfer process to additively fabricate conductive patterns has been developed. A permeant antiadhesive mask is printed on carrier copper foil, and then, BTA is adsorbed onto the exposed area of the carrier foil, thus forming the template. The template is electroplated to grow conductive patterns in the exposed parts, and then can be adhered to the flexible substrate. The substrate is peeled off, with the transfer of the conductive patterns to the substrate, to form the designed conductive patterns on PET. By reimmersing the template into BTA solution, the template can be used again. The mechanism of BTA adsorption and the reason for the low peeling strength are researched using Raman spectra, XPS and electrochemical impedance spectroscopy. Copper patterns more than 20 μm in thickness can be prepared on PET, the resistivity of the prepared copper patterns is 2.01 μΩ cm, which is about the same as bulk copper, and the peeling strength of the pattern on PET is measured to be 6.97 N/cm. This template transfer process, with no waste, low pollution, high electrical and adhesion properties, and low cost, shows high potential in the large scale manufacturing of electronic devices, such as RFID circuitry, FPCs, etc.

Tapered Cu Pattern Metallization by Electrodeposition Through Mask

Forming Tapered Pattern by Cu Electrodeposition Through Mask on Ni Seed Layer for Thin-Film Transistors

Potential-Dependence Of Additives Distribution In Copper Electrodeposition Via Filling

Modeling the Copper Electrodeposition of Through-silicon-vias Corresponded to Linear Sweep Voltammetry

The Influence of Self-Assembled Disulfide Additive on the Pattern Shape by Cu Electrodeposition Through Mask

Maskless metal patterning by meniscus-confined electrochemical etching and its application in organic field-effect transistors

Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system

A facile and universally applicable additive strategy for fabrication of high-quality copper patterns based on a homogeneous Ag catalyst ink

Fabrication of copper patterns on flexible substrate by patterning-adsorption-plating process.

RETRACTED: Copper Electrodeposition in Through-Silicon Via under Galvanostatic Condition

P‐7.9: The Specification Study of Taper Angle in Metal Wire Electrode of TFT‐LCD

Preparation of Selective Conductive Copper Patterns by Pen-on-paper Writing Combined with Electroless Plating

Lifting Polyether Suppression during Cu Electrodeposition

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

Additive Fabrication of Conductive Patterns by A Template Transfer Process Based on Benzotriazole Adsorption As A Separation Layer

Modified PEDOT-PSS Conducting Polymer as S/D Electrodes for Device Performance Enhancement of P3HT TFTs

Surface Catalytic Modification of Conjugated Polymer on Low‐Cost Bottom Contact for Improved Injection Efficiency of Organic Transistors

Fabrication of a high-aspect-ratio stainless steel shadow mask and its application to pentacene thin-film transistors

Additive Preparation of Conductive Circuit Based on Template Transfer Process Using a Reusable Photoresist

Facile and Rapid Method for Fabricating Liquid Metal Electrodes with Highly Precise Patterns via One‐Step Coating

3D Porous Polysiloxane Ion-Adsorption Films for Additive Fabrication of Conductive Patterns with High Adhesion