High-Reliable Polyurethane Modified Epoxy Photosensitive Composites for Solder Resist Applications
Jialin Zhang,Jialin Tian,Tao Wng,Xialei Lv,Shuye Zhang,Jinhui Li,Guoping Zhang,Rong Sun
DOI: https://doi.org/10.1016/j.coco.2024.102180
IF: 8
2024-01-01
Composites Communications
Abstract:Developing solder resist ink (SR) with superior comprehensive performance through the chemical modification of epoxy resin (EP) using polyurethane oligomers (PU) is an effective strategy. In this study, a highly reliable SR was designed by chemically grafting -NCO terminated PU onto the -OH groups of the EP molecular chain. By adjusting the PU content, high flexibility, reliability, and adhesion of the EP-PU system were achieved. Compared to SR-0, when the PU content is 50% of EP, under conditions of 85% humidity, 130 oC temperature, and 1 V voltage, the failure time of SR-0.5 can be adjusted from 67.5 hours to over 150 hours, an increase of 150%. This high-reliability characteristic makes it potentially useful in applications such as printed circuit board and packaging substrate manufacturing. Additionally, by adjusting the PU content in the EP-PU system, the degree of crosslinking in the EP-PU molecular chain can be controlled, resulting in excellent adhesion, alkali resistance, hydrophobicity, mechanical properties, low water absorption, and good thermal stability. The chemical modification of EP with PU provides a theoretical basis and technical support for the development of high-performance SR, while also offering more reliable material solutions for the advancement of the electronics industry.