Preparation and characterization of hyperbranched polyester-based solder resist for inkjet printing

YANG Chao,YANG Zhen-guo
DOI: https://doi.org/10.3969/j.issn.1009-0096.2013.12.007
2013-01-01
Abstract:As printable solder resist has been researched recently, the solder mask prepared by ink-jet printing technology shows unstable properties and uneven linewidth due to resins possess shear-thinning nature and thixotropy. A novel hyperbranched acrylate polyester resin was synthesized with Boltorn H20. The resin was mixed with TMP3EOTA and UV curing agent to prepare solder resist ink. The ink was cured under 1 w/cm2 UV light source and the duration of curing was less than 20s. The cured mask was degraded over the temperature of 300℃ and also satisfied the standard of IPC-SM-840C and CPCA 4306-2011.
What problem does this paper attempt to address?