Abstract:The purpose of this paper is to study the performance improvement of memory architectures for three-di-mensional chip multi-processors(3D CMPs).As CMPs integrate more and more cores,a great deal of data access pressure is placed on the memory subsystem.Designers face the challenges of feeding enough data to a massive number of on-die cores for CMPs.Three-dimensional integrated circuits(3D ICs)can stack memories of different process technologies into the same chip.The stacking memory bandwidth can be enlarged by using fine-pitch through-silicon vias(TSVs),which can mitigate the pressure on the I/O infrastructure for CMPs.In this paper,we start with studying the potential benefit of 3D integration and the recent advantages on the research of memory ar-chitectures for 3D CMPs.Bothe large caches and main memories can be stacked in 3D CMPs.Hence,we focus on the memory architectures for 3D CMPs in two aspects,stacking cache architecture and stacking main memory architecture.3D CMPs can integrate much larger L2 caches compared to their 2D counterparts in the same area footprint.Meanwhile,the L2 caches can be several layers.We firstly explore the performance improvements of stacking SRAM L2 cache layers atop processor layers for 3D CMPs.The experimental results show that the 3D CMPs with 2 L2 cache layers can improve the performance up to 55% and 34% on average compared to that of 3D CMPs with 1 L2 cache layer.3D CMPs provide opportunities for composing future systems by integrating disparate technologies memories.The off-chip DRAM main memories can be stacked on the processor layers.We secondly study the performance benefit of integrating DRAM main memories into 3D CMPs.The experiment results show that stacking DRAM main memories can provide up to 80% and on average 34.2% performance improvement for 3D CMPs compared to the 2D CMPs with off-chip DRAM main memory.Our analysis and experimental results give a guideline to design efficient 3D CMPs with stacking SRAM L2 caches and DRAM main memories.

Exploration of 3D Stacked L2 Cache Design for High Performance and Efficient Thermal Control

Performance/Thermal-Aware Design of 3D-Stacked L2 Caches for CMPs

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The study of memory architectures for 3D chip multi-processors

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A Novel Architecture Of The 3d Stacked Mram L2 Cache For Cmps

Thermally-Aware Multi-Core Chiplet Stacking

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

Architecting On-Chip Interconnects for Stacked 3D STT-RAM Caches in CMPs

Exploring Stacked Main Memory Architecture for 3d Gpgpus

Architecting High-Performance Energy-Efficient Soft Error Resilient Cache under 3D Integration Technology

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Thermal-Scalable 3D Parallel-Heat-Sinking Integration Methodology:Key SoC Technology for Large-Scale Parallel Computing

System-Level Analysis of 3D ICs with Thermal TSVs

Investigation On The Effect Of Multiple Parameters Towards Thermal Management In 3d Stacked Ics

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Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration.

Temperature-Aware DRAM Cache Management—Relaxing Thermal Constraints in 3-D Systems