Abstract:The purpose of this paper is to study the performance improvement of memory architectures for three-di-mensional chip multi-processors(3D CMPs).As CMPs integrate more and more cores,a great deal of data access pressure is placed on the memory subsystem.Designers face the challenges of feeding enough data to a massive number of on-die cores for CMPs.Three-dimensional integrated circuits(3D ICs)can stack memories of different process technologies into the same chip.The stacking memory bandwidth can be enlarged by using fine-pitch through-silicon vias(TSVs),which can mitigate the pressure on the I/O infrastructure for CMPs.In this paper,we start with studying the potential benefit of 3D integration and the recent advantages on the research of memory ar-chitectures for 3D CMPs.Bothe large caches and main memories can be stacked in 3D CMPs.Hence,we focus on the memory architectures for 3D CMPs in two aspects,stacking cache architecture and stacking main memory architecture.3D CMPs can integrate much larger L2 caches compared to their 2D counterparts in the same area footprint.Meanwhile,the L2 caches can be several layers.We firstly explore the performance improvements of stacking SRAM L2 cache layers atop processor layers for 3D CMPs.The experimental results show that the 3D CMPs with 2 L2 cache layers can improve the performance up to 55% and 34% on average compared to that of 3D CMPs with 1 L2 cache layer.3D CMPs provide opportunities for composing future systems by integrating disparate technologies memories.The off-chip DRAM main memories can be stacked on the processor layers.We secondly study the performance benefit of integrating DRAM main memories into 3D CMPs.The experiment results show that stacking DRAM main memories can provide up to 80% and on average 34.2% performance improvement for 3D CMPs compared to the 2D CMPs with off-chip DRAM main memory.Our analysis and experimental results give a guideline to design efficient 3D CMPs with stacking SRAM L2 caches and DRAM main memories.

A Survey of Memory Architecture for 3d Chip Multi-Processors

The study of memory architectures for 3D chip multi-processors

Performance/Thermal-Aware Design of 3D-Stacked L2 Caches for CMPs

Exploration of 3D Stacked L2 Cache Design for High Performance and Efficient Thermal Control

A 3D SoC Design for H.264 Application with On-Chip DRAM Stacking

System-Technology Co-Optimization for 3D Monolithic Memory-Centric Computing

A Novel Architecture Of The 3d Stacked Mram L2 Cache For Cmps

Exploring Stacked Main Memory Architecture for 3d Gpgpus

Architecting On-Chip Interconnects for Stacked 3D STT-RAM Caches in CMPs

Influence of Stacked 3D Memory/Cache Architectures on GPUs

Demystifying the Characteristics of 3D-Stacked Memories: A Case Study for Hybrid Memory Cube

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A Multi-Chiplet Computing-in-Memory Architecture Exploration Framework Based on Various CIM Devices

Exploring the vulnerability of CMPs to soft errors with 3D stacked non-volatile memory

Circuit and Microarchitecture Evaluation of 3D Stacking Magnetic RAM (MRAM) As a Universal Memory Replacement

3D Gpu Architecture Using Cache Stacking: Performance, Cost, Power and Thermal Analysis

Cost-Aware Lifetime Yield Analysis of Heterogeneous 3D On-chip Cache

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

Understanding the Memory Behavior of Emerging Multi-core Workloads

A Customized Design Of Dram Controller For On-Chip 3d Dram Stacking