Effects of Wall Temperature on the Heat and Mass Transfer in Microchannels Using the DSMC Method

Jianjun Ye,Jian Yang,Jinyang Zheng,Ping Xu,Chikong Lam,Leong Wong,Yanbao Ma
DOI: https://doi.org/10.1109/nems.2009.5068668
2009-01-01
Abstract:Micro-electro-mechanical systems (MEMS) and nano-electro-mechanical systems (NEMS) have become the research focuses which attract a great deal of attention in recent years. The fluidic and thermal behaviors are usually different from those of the macro devices. In this paper, the heat and mass transfer characteristics of the rarefied nitrogen gas flows in microchannels are investigated using DSMC method. In order to study the effects of the wall temperature (Tw) on the mass flux and wall heat flux in the microchannels, the temperature of the incoming gas flow (T∞) is set constant at 300 K, and the wall temperature varies from 200 K to 800 K. For all of the simulated cases, majority of wall heat flux stays within the channel entrance region and drops to nearly zero when it reaches the middle region of the channel. When Tw ≪ T∞, with the restriction of the pressure driven condition and continuity of pressure, the number density of the flow has to decrease along the flow direction eventually after a short increase at the entrance region. When Tw ≫ T∞, the number density of the flow drops rapidly near the inlet, and the temperature of the gas flow increases. As the Tw increases, the flow becomes more rarefied, the mass flux decreases, and the resistance at the entrance region increases. Furthermore, when Tw ≫ T∞, sudden jump in heat transfer flux and temperature are observed at the exit region of the channel.
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