Abstract:This paper investigates for the first time the piezojunction effect in heterojunctions under external bias for ultrasensitive strain sensing. As a proof of concept, we used sensing devices made of 3C-SiC/Si heterostructure with vertically aligned electrodes. Applying the beam bending method to characterize the sensing effect, the bending strain was introduced along the typical orientation [100] or [110] on (100) Si plane. Experimental results show a linear relationship between the relative change in the forward current and the applied strain from 0 to 500 ppm, decreasing under the tensile strain while increasing under the compressive strain. At the forward bias of 8 V, the obtained gauge factors ( GFs) are 199.7 for [100] orientation and 173.1 for [110] orientation, which significantly enhance about 630 % and 540 % compared to the highest GF of n-type 3C-SiC in the literature. Interestingly, the GFs of the n + -3C-SiC/p-Si heterostructure are positive in contrast to the negative GFs of n-3C-SiC thin films. The results were explained by the strain modulation on the band split and electron mass shift along the out-of-plane direction as well as by the change in the barrier height, depletion region width, and carrier concentrations under the forward bias. The ultrasensitive piezojunction effect in the 3C-SiC/Si heterojunction demonstrated in this study can pave the way toward developing ultrasensitive mechanical sensors.

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