Abstract:3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-on-chip design, by integrating different modules together with less interference with each other. In this paper, we propose a novel thermal-aware 3D cell placement approach, named T3Place, based on transforming a 2D placement with good wirelength to a 3D placement, with the objectives of half-perimeter wirelength, through-the-silicon (TS) via number and temperature. T3Place is composed of two steps, transformation from a 2D placement to a 3D placement and the refinement of the resulting 3D placement. We proposed and compared several different transformation techniques, including local stacking transformation (LST), folding-2, folding-4 and window-based stacking/folding transformation, and concluded that (i) LST can generate 3D placements with the least wirelength, (ii) the folding-based transformations result in 3D placements with the fewest TS vias, and (iii) the window-based stacking/folding transformations provide good TS via number and wirelength tradeoffs. For example, with four device layers, LST can reduce the wirelength by over 2times compared to the initial 2D placement, while window-based stacking/folding can provide over 10times variation in terms of the TS via number, thus adaptive to different manufacturing ability for TS via density. Moreover, we proposed a novel relaxed conflict-net (RCN) graph-based layer assignment method to further refine the 3D placements. Compared to LST results, thermal-aware RCN graph-based layer assignment algorithm (r = 10%) can further reduce the maximum on-chip temperature by 37%, with only 6% TS via number increase and 8% wirelength increase.

Thermal-driven Symmetry Constraint for Analog Layout with CBL Representation.

Symmetry Constraint for Analog Layout with CBL Representation

Symmetry Constraint Based on Mismatch Analysis for Analog Layout in SOI Technology

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Thermal Constraints for BBL Placement

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”

Thermal aware placement in 3D ICs using quadratic uniformity modeling approach

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

Thermal-Aware 3d Placement

Thermal-aware electrical analysis of high-speed interconnect

An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

The thermal stress analysis in 3D IC integration with TSV interposer

A layout-to-simulation approach for thermal design of IC

Thermal-Aware 3D IC Placement Via Transformation

Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array

Automated analog circuits symmetrical layout constraint extraction by partition

A New Constraint-Driven Placement Approach for Analog Circuits