The effect of surface preparation on high temperature oxidation of Ni, Cu and Ni-Cu alloy

Daria Serafin,Wojciech J. Nowak,Bartek Wierzba
DOI: https://doi.org/10.48550/arXiv.1909.13659
2019-09-30
Applied Physics
Abstract:In the present paper, the analysis of polishing, grinding and sand-blasting processes on oxidation behavior of nickel, copper and nickel-copper alloy has been investigated. Surface roughness has been measured using two methods: by contact profilometer and by fractal analysis. It has been proved that sand-blasting process influences the surface roughness the most but also contaminates the surface with alumina particles. The oxidation tests were performed in thermogravimetrical furnace. The obtained mass gain plots, SEM microphotographs of cross-sections and SEM EDS analysis of the samples prove that surface preparation changes oxidation kinetics morphology of the polished and ground samples does not vary significantly after oxidation at investigated temperatures, but differences in oxide layer thicknesses and mass gains were observed. Oxidized sandblasted samples reveal that increased surface roughness and alumina intrusions change the oxidation process mixed Al (Ni, Cu or Ni-Cu) oxide is formed and separate Al2O3 particles are visible. The results prove that surface preparation influence high temperature oxidation of the samples by promoting new diffusion mechanism.
What problem does this paper attempt to address?