Abstract:Expertise of packaging for optoelectronic components requires the solution of optical, mechanical, and electrical problems in the same way. The purpose of this paper is to present three-dimensional simulations using finite-element method (FEM) of thermomechanical stresses and strains in 1550-nm laser modules induced by Nd:YAG crystal laser welds and thermal cycles on main subassembly laser submount. Nonlinear FEM computations, taking into account of experimental sigma(epsiv) measured curves, show that the laser welding process can induce high level of strains in columns of the laser platform, bearing the laser diode, responsible of an optical axis shift and a gradual drop of the optical power in relation with relaxation of accumulated stresses in the subassembly (W. M. Sherry et al., ldquoHigh performance optoelectronic packaging for 2.5 and 10 Gb/s laser modules,rdquo in Proc. Electron. Compon. Technol. Conf., 1996, pp. 620-627). Typical stresses are close to 160 MPa with drift about 5 MPa with the dispersion of energy level of the laser Nd: YAG beam. The introduction of both material and process dispersion in order to evaluate their impact on product lifetime distribution has been taking into account. In the case of thermal cycles, stresses can occur on elements sensitive to coefficient of thermal expansion mismatches such as solder joints between the laser platform and thermoelectric cooler and as fiber glued into the pigtail leading to crack propagation with sudden drop of optical power. A previous paper demonstrated that laser submount is the most sensitive part of optical system (Deshayes, et al., ldquoThree-dimensional FEM simulations of thermal mechanical stresses in 1.55 mum laser modules,rdquo Microelectron. Rel., vol. 43, no. 7, pp. 1125 -1136, Jul. 2003). Experimental analyses were also conducted to correlate simulation results and monitor the output optical power of laser modules after 500 thermal cycles ( -40degC/ + 85degC VRT).

Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions

Optical-mechanical-thermal Analysis on Prism Assembly of Precision Light Beam Scanner

Numerical simulation of thermo-mechanical behavior in high power diode laser arrays

Thermally Induced Misalignment in Laser Packaging of Optical Modules

Thermo-mechanical Modeling of Laser-Driven Non-Contact Transfer Printing: Two-Dimensional Analysis

Simulation Study on Thermal Characteristics and Thermal Stress of Semiconductor Laser Package

Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package

Numerical and experimental investigation into the evolution and distribution of residual stress in laser transmission welding of PC/Cu/PC

Finite Element Thermal Analysis of Optical Elements in a Laser Incoherent Space Beam Combiner

3-D FEM simulation of laser shock processing

Residual Thermal Stress of a Mounted KDP Crystal after Cooling and Its Effects on Second Harmonic Generation of a High-Average-power Laser

Precise prediction of optical behaviour of mechanically stressed edge emitting GaAs devices

Thermomechanical Process Simulation and Experimental Verification for Laser Additive Manufacturing of Inconel®718.

Effect Analysis of Embedded Fiber Transmission Performance by Lamination Process

Computational Modeling and Experimental Validation of Thermal Stress and Melt Pool Characteristics Using High Power Laser Diode Beam on 7075 Aluminum Alloy

Thermal Optimization of Single Crystal Fiber Manufacturing Based on Heat Loss Compensation

Laser-induced stress by multi-beam femtosecond pulses in fused silica

Thermal Design Considerations for III-N Vertical-Cavity Surface-Emitting Lasers Using Electro-Opto-Thermal Numerical Simulations

Simulation of thermo-effects in average-power Pockels cell and stress-induced birefringence compensation

Numerical Simulation and Experimental Analysis of Thermal Conduction and Stress in Laser Cladding Repair of Thin-Walled Parts

Reliability Research on the Thermal Deformation and Thermal Stress of the Metal Packaging with Low Resistance and High Electric Current