Abstract:A computer is mainly composed of chips on which a large number of semiconductor switches are fabricated. The requirement for increasing signal speed in the computer has focused the efforts of electronics industry on designing miniaturized electronic circuits and highly integrated circuit densities in chips. The integration technologies, which have advanced to the very large scale integration (VLSI) level, lead to an increased power dissipation rate at the chip, module and system levels. Sophisticated electronic cooling technology is needed to maintain relatively constant component temperature below the junction temperature, approximately 85°C for most mainframe memory and logic chips. Investigations have demonstrated that a single component operating 10°C beyond this temperature can reduce the reliability of some systems by as much as 50% (Nelson, 1978). Traditionally, convection heat transfer from electronic hardware to the surroundings has been achieved through the natural, forced, or mixed convection of air; however, even with advances in air-cooling techniques, the improvements will not suffice to sustain the expected higher heat fluxes. As an effective and increasingly-popular alternative to air cooling, directly immersing the component in inert, dielectric liquid can remove a large amount of heat dissipation, of which pool and forced boiling possess the attractive attribute of large heat transfer coefficient due to phase change compared with single-phase. An ideal boiling performance should provide adequate heat removal within acceptable chip temperatures. Direct liquid cooling, involving boiling heat transfer, by use of dielectric liquids has been considered as one of the promising cooling schemes. Primary issues related to liquid cooling of microelectronics components are mitigation of the incipience temperature overshoot, enhancement of established nucleate boiling and elevation of critical heat flux (CHF). Treated surface has been found to have great potential in enhancement of boiling heat transfer from electronic, significantly reducing the chip surface temperature and increasing CHF. Treated surfaces are used for nucleate boiling enhancement by applying some micro-structures on the chip surface to make the surface capable of trapping vapour and keeping the nucleation sites active or increasing effective heat transfer area. Since the 1970s, a number of active studies have dealt with the enhancement of boiling heat transfer from electronic components by use of surface microstructures that were fabricated directly on a silicon chip or on a simulated chip. These include a sand-blasted and KOH treated surface (Oktay 1982), a “dendritic heat sink” (brush-like structure) (Oktay and

Key factors affecting the boiling heat transfer coefficient of FC-72 in saturated pool boiling using lotus-type porous copper

An open superhydrophilic microchannel heat sink for thin film boiling with a high coefficient of performance

Composite porous surfaces of microcavities for enhancing boiling heat transfer

ENHANCED BOILING HEAT TRANSFER OF FC-72 FROM SURFACES WITH MICROSTRUCTURES

Enhanced flow boiling heat transfer of FC-72 on micro-pin-finned surfaces

Pool boiling heat transfer of dual-scale porous microchannel for high-power electronics cooling

Pool Boiling Heat Transfer Enhancement on the Hybrid Surfaces Coupling Capillary Wick and Minichannels

Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications

Boiling Heat Transfer Enhancement by Using Micro-pin-finned Surface for Electronics Cooling

Pool Boiling Enhancement Via Surface Engineering for Thermal Management

SUBCOOLED JET IMPINGEMENT BOILING ENHANCED BY POROUS SURFACE WITH MICROCOLUMN ARRAY

CHF Correlation of Boiling in FC-72 with Micro-Pin-fins for Electronics Cooling

Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips

Pool Boiling Performance of Multilayer Micromeshes for Commercial High-Power Cooling

Hybrid Surfaces with Capillary Wick and Minichannels for Enhancement of Phase-Change Immersion Cooling of Power Electronics

Experimental Study on Heat Transfer Performance of Lotus-Type Porous Copper Heat Sink

Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72

Experimental Study of Pool Boiling Heat Transfer on Novel Bistructured Surfaces Based on Micro-Pin-finned Structure

Experimental Study of Flow Boiling Heat Transfer Coefficient of Fc-72 over Micro-Pin-Finned Surfaces

ENHANCED HEAT TRANSFER OF FLOW BOILING COMBINED WITH JET IMPINGEMENT

Enhanced Capillary‐Fed Boiling in Copper Inverse Opals via Template Sintering