Abstract:Due to the escalating demands for computational power, coupled with a continuous reduction in the size of electronic packaging, thermal management for electronic devices has become increasingly critical in recent years. Ensuring that the temperature of electronic chips remains below a certain threshold is essential, since overheating can result in a decline in performance and chip breakdowns. To address the intensive cooling needs of heat-emitting chips, a variety of devices and methods have been explored, such as heat pipes, vapor chambers, pool boiling, spray cooling, and jet impingement cooling. Tailoring thermal and chemical characteristics of the target heated surface is one of the key factors in enhancing heat removal efficiency. This study highlights the critical role of employing advanced surface engineering techniques which particularly focuses on the integration of a novel semi-layered microporous copper structure, developed in conformity with a multi-level micro-cubic pin fin silicon substrate. The semi-layered microporous copper structure is fabricated using polystyrene sphere as the template to assist the electrodeposition of copper, with a low current density being employed to ensure meticulous fabrication. The initial gradient of the muti-level substrate is defined using silicon dioxide as the mask, setting the depth to encapsulate the PS template effectively. This foundational layer is crucial for confining the PS template securely in place. The second gradient is defined using photoresist as the mask to etch micro pin fin structures into the substrate, aimed at enhancing the adhesion between the substrate and the PS template and expand the heat exchange area. This meticulous structuring prevents the template from detaching during large-scale electroplating operations, ensuring the integrity of the micro fabrication process. The semi-layered microporous copper and the multi-level micro-cubic pin fin silicon substrate are both strategically designed to augment nucleation sites and enlarge the heat exchange surface area during the boiling heat transfer process within a pool boiling system. Further enhanced by the jet flow disturbances aimed directly at the heat transfer surface, facilitating rapid bubble removal and liquid replenishment, which contributes to delaying the onset of dry out. By employing Novec 649 as the coolant under a jet flow rate of 2.5L/min, we've reached a critical heat flux of 90/Wcm2 on a semi-layered microporous copper structure over a large heated area of 1.5 x 1.5 cm. This research provides valuable knowledge that can inform the development of highly effective surface engineering designs in high heat flux management systems.

Pool Boiling Performance of Multilayer Micromeshes for Commercial High-Power Cooling

Pool boiling heat transfer of dual-scale porous microchannel for high-power electronics cooling

Pool Boiling Enhancement Via Surface Engineering for Thermal Management

Composite porous surfaces of microcavities for enhancing boiling heat transfer

Pool boiling enhancement of novel interconnected microchannels with reentrant cavities for high-power electronics cooling

High performance heat sink with counter flow diverging microchannels

Liquid Super‐Spreading Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling

An open superhydrophilic microchannel heat sink for thin film boiling with a high coefficient of performance

Experimental and parametric study in pool boiling enhancement with self-induced jet impingement on the microporous copper surface using R1336mzz(Z)

Hybrid Surfaces with Capillary Wick and Minichannels for Enhancement of Phase-Change Immersion Cooling of Power Electronics

Design of micro-nano structures for counter flow diverging microchannel heat sink with extraordinarily high energy efficiency

Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications

Experimental studies for the combined effects of micro-cavity and surface wettability on saturated pool boiling

Experimental study of flow boiling in microchannel heat sink enhanced with partially in-line pin fins fence arrangement

Enhanced pool boiling on composite microstructured surfaces with microcavities on micro-pin-fins

Enhanced pool boiling on micro-nano composited surfaces with nanostructures on micro-pin-fins

Investigation of Z-type Manifold Microchannel Cooling for Ultra-High Heat Flux Dissipation in Power Electronic Devices

Achieving robust and enhanced pool boiling heat transfer using micro–nano multiscale structures

Experimental and computational investigation on synergistic enhancement spray cooling using micropillars and capillary-driven wicking hybrid structures

Hierarchically 3D-textured copper surfaces with enhanced wicking properties for high-power cooling

Hierarchical gradient mesh surfaces for superior boiling heat transfer