Abstract:Due to the slow scaling of board and package technology, on-chip inductor has shown promising potential to enable more compact design and smaller parasitics for inductor-based designs, such as voltage regulator, resonant clocking, filter, etc. On the other hand, conventional on-chip 2D spiral inductor must be placed on the top metal layers, thereby consuming significant routing resources for global interconnects. Moreover, it may need more dedicated shielding to prevent unnecessary coupling, which further increases its occupied area. With the popularity of 2.5D and 3D chip architecture, Through-Silicon-Via (TSV) has been widely used, a significant portion of which are placed for thermal/manufacturability/reliability purposes. Thus, those redundant TSVs can be utilized to form the on-chip inductor for 2.5D/3D chips, with lower footprint and higher inductance density compared from the conventional spiral inductor. Unlike prior works focusing on the inductor itself, this paper discusses the optimization and application of such TSV-inductor from system perspective, including the optimization options and its design considerations. The possible design options including physical parameters, architecture and materials, to optimize the TSV-inductor are thoroughly investigated. Based on that, we further study a few key design scenarios to evaluate the design impact with use of such TSV-inductor and provide the design guidelines for its application in actual system designs.

A two-step optimization strategy for the inductance control of TSV-based 3-D inductor based on the SAE model

Multi-objective Design and Optimization of Inductors: A Generalized Software-Driven Approach

System-level Design Consideration and Optimization of Through-Silicon-via Inductor.

TSV inductor optimization and its design implication

On the Efficacy of Through-Silicon-Via Inductors

Wide-Load Range Multiobjective Efficiency Optimization Produces Closed-Form Control Solutions for Dual Active Bridge Converter

Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs

Through-silicon-via inductor: Is it real or just a fantasy?

Opportunistic through-silicon-via inductor utilization in LC resonant clocks: Concept and algorithms

Modeling of TSV-based Solenoid Inductors for 3-D Integration

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

&Amp;#x0022;green&#x0022; On-chip Inductors in Three-Dimensional Integrated Circuits

Development of an Inductor Design Tool Based on Multi-Objective Optimization and Finite Element Simulation

Stacked Spiral Inductor Design and Modeling for Fully-Integrated DC-DC Converters

Optimized Design for the Inductor of Shunt Active Power Filter Based on Multi-Objective 4-D Visualization Algorithm

A global genetic algorithm based optimization technique for spiral inductor on silicon design

Stepped-shape Field Winding Optimization of a Large Capacity HTS Aircraft Propulsion Machine

A Novel Technique Fast Optimizing the Layout Parameters of Planar Spiral Inductor

Modeling and optimization of magnetic core TSV-inductor for on-chip DC-DC converter

Single-Inductor–Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery

An Optimization Method for Compensation Network Parameters in Double-Sided LCC Wireless Power Transfer System