Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling

Yuqian Zhang,Hailong He,Chunping Niu,Yi Wu,Mengmeng Liu,Mingzhe Rong
DOI: https://doi.org/10.1021/acsami.4c00856
IF: 9.5
2024-05-16
ACS Applied Materials & Interfaces
Abstract:For practical industrial applications, enhancing the longevity and the reliability of thermoelectric modules (TEMs) is equally as crucial as improving their conversion efficiency. This study proposes a strategy for extending the lifespan and introduces the quality evaluation criteria for the most extensively used commercial bismuth telluride TEM. By varying the soldering pressure during module assembly, its impact on the quality of the module's internal interfacial connections was investigated,...
materials science, multidisciplinary,nanoscience & nanotechnology
What problem does this paper attempt to address?