In-situ crosslinking of a novel conjugated dialkynyl-based polyimide for high performance carbon molecular sieve membrane

Zelong Xu,Qingtan Liu,Lujun Huang,Wenju Zhu,Xiaohua Ma
DOI: https://doi.org/10.1016/j.memsci.2024.122572
IF: 9.5
2024-02-16
Journal of Membrane Science
Abstract:High-performance and reliable membranes for efficient gas separation and their design strategies are key points for membrane-based carbon capture. Here, we reported a high-performance carbon membrane design protocol from a microporous, highly rigid polyimide precursor (6FBD1-CR), which was produced by in-situ crosslinking a polyimide (6FBD1) containing conjugated dialkynyl group at 300 °C. The possible crosslinking mechanisms are the [2+2+2] trimerization of three ethynyl groups to form a benzene ring and the Diels-Alder reaction between the ethynyl bond and phenylacetylene to generate the fused naphthalene ring. After crosslinking, the membrane shows a ∼ 8-fold improved microporosity (37.1–298 m 2 g −1 ). When pyrolyzed at 550 °C, the resulting 6FBD1-CMS demonstrates very high pure- and mixed-gas separation performance. E.g., the CO 2 permeability reaches 7661 Barrer and CO 2 /CH 4 selectivity of 44, additionally, even at the CO 2 /CH 4 mixed-gas pressure of 30 bar, the P CO2 can still reach 4920 Barrer combined with a α CO2/CH4 of 28, which is well above the latest CO 2 /CH 4 mixed-gas Upper Bound line. We consider this is due to the acetylene crosslinking induced a very stable microporous structure composed of rigid fused rings that alleviate the micropore collapse during the carbonization process, and thus, resulting in a relatively higher BET surface area, larger d-spacing, relatively higher concentration of continuous disordered phase (higher sp 3 /sp 2 ) and small activation energy (Ep) for gas transport than the CMSM derived from polyimide without pre-crosslinking. This finding provides new opportunity for the structural design of high-performance CMSMs.
engineering, chemical,polymer science
What problem does this paper attempt to address?