“Drop-in” Conventional Reflow Oven Sinter-Able Pressure-Less Silver Paste for Die-Attach Assembly Mass Production
Sihai Chen,Evan Wernicki,Sara Wright,Christine LaBarbera,Ning-Cheng Lee
DOI: https://doi.org/10.4071/2380-4505-2019.1.000535
2019-10-01
International Symposium on Microelectronics
Abstract:Abstract During the experiment, pressure-less silver sintering pastes that can sinter using a conventional reflow oven for die-attach applications were developed. This development makes it possible to produce die-attach assemblies in a continuous and high throughput fashion for mass production. Different reflow profiles such as “ramp-up and peak” and “ramp-up and plateau” types were tested and high shear strength joints with no voids were obtained. For each sample, the sintering time was around twelve minutes or less, which is about one order of the magnitude that is presently used for box oven sintering time. Two sintering pastes, A and B, were developed. Paste A has been used to study the relationship between processing conditions (reflow oven sintering temperature and atmosphere such as air vs nitrogen) and the die-attach structures (with varied substrate materials such as copper or active metal brazing (AMB) and surface metallization such as copper, silver, or gold). Under the same combined conditions of sintering temperature, atmosphere, and substrate type, the Ag metalized substrate gave the strongest joint shear strength. In comparison, Au metalized substrate displayed the weakest strength because of the formation of a “depletion layer” as a result of the diffusion of silver on gold surface, leaving behind a weak connection between sintered silver and Ag-Au layer. For the above noble metal metallized surfaces, sintering in air normally results in stronger joint shear strength than that in a nitrogen atmosphere. On the bare Cu metallized surface with nitrogen sintering, increasing the sintering temperature and changing to paste B are two ways to increase joint shear strength. Sintering on an AMB substrate displays around 10Mpa higher shear strength than that on a Cu substrate, indicating the importance of surface morphology. When sintering at 250°C in air, oxygen can help accelerate the inter-diffusion between Cu substrate and sintered Ag and enhance interfacial adhesion, increasing the shear strength. A higher sintering temperature reduces the adhesion due to the formation of large amounts of copper oxide; therefore, control of the optimum temperature range is key to obtaining a strong joint in air.
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