Understanding the Impact of Contact-Induced Strain on the Electrical Performance of Monolayer WS2 Transistors

Lauren Hoang,Marc Jaikissoon,Çağıl Köroğlu,Zhepeng Zhang,Robert K A Bennett,Jung-Hwan Song,Jerry A Yang,Jung-Soo Ko,Mark L Brongersma,Krishna C Saraswat,Eric Pop,Andrew J Mannix
DOI: https://doi.org/10.1021/acs.nanolett.4c02616
2024-10-04
Abstract:Two-dimensional (2D) electronics require low contact resistance (RC) to approach their fundamental limits. WS2 is a promising 2D semiconductor that is often paired with Ni contacts, but their operation is not well understood considering the nonideal alignment between the Ni work function and the WS2 conduction band. Here, we investigate the effects of contact size on nanoscale monolayer WS2 transistors and uncover that Ni contacts impart stress, which affects the WS2 device performance. The strain applied to the WS2 depends on contact size, where long (1 μm) contacts (RC ≈ 1.7 kΩ·μm) show a 78% reduction in RC compared to shorter (0.1 μm) contacts (RC ≈ 7.8 kΩ·μm). We also find that thermal annealing can relax the WS2 strain in long-contact devices, increasing RC to 8.5 kΩ·μm. These results reveal that thermo-mechanical phenomena can significantly influence 2D semiconductor-metal contacts, presenting opportunities to optimize device performance through nanofabrication and thermal budget.
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