Abstract:The demand for polished silicon wafers has increased significantly in recent years to cater to the development of the semiconductor industry. For example, polished silicon wafer has direct applications in integrated circuits, radio frequency amplifiers, micro-processors, micro-electromechanical systems, etc. To carry out mechanical polishing, lapping, grinding, or single-point diamond turning of silicon, diamond abrasives were extensively used before the implementation of chemo-mechanical polishing. During the diamond-based polishing, a few problems have already been identified, such as the formation of an amorphous phase, heat-affected zones, low material removal, etc. Some research work has also reported that nano-structured abrasives lead to a thin layer of the amorphous phase and a better material removal rate. In the same direction, a molecular dynamics simulation is carried out in this paper to investigate the mechanism of material removal from monocrystalline silicon during the diamond-abrasive-based polishing process. The present work is mainly focused on the dynamics of material removal phenomena near the abrasive particles at the nanometric scale by considering stress, lattice, cohesive energy, etc. This reveals that a higher value of indentation force results in surface buckling, which creates a zone of both compressive and tensile stresses, which increases the coordination number and forms β-silicon just ahead of the abrasive particle. This mechanism happens by developing a β-silicon phase on the surface with a thickness beyond a certain value of indentation force on the zone of compression. Buckling on this phase happens due to stress localisation in compression, as the flow stress of this phase is less than that of diamond cubic lattices. To avoid the mechanism of surface buckling and process silicon material on the surface, the indentation force needs to be maintained below a critical value. In the present case, it was found that the indentation force of less than or equal to 190 nN for the abrasive size of φ8 nm does the material removal by surface processing only without surface buckling. It was also found that surface processing helps to reduce the depth of the amorphous layer significantly without compromising the material removal rate or the generation of a wavy surface. Thus, the present mechanism will help in the polishing of silicon with minimum defects and reduce processing time for the final stage of polishing towards manufacturing ultra-smooth and planer surfaces.

Surface characterization of the diamond polishing pads and their performance evaluation in nanofinishing of electroless nickel plating

Effect of ultrasonic on properties of electroplated diamond tools

Precision finishing of nickel-phosphorus plated carbon fibre reinforced polymer

Approach: developing nano/sub-micron diamond slurry technology for enhanced precision polishing of optoelectronic materials

Ultrafine Polishing of Electroless Nickel–Phosphorus-Plated Mold with Magnetic Compound Fluid Slurry

Analysis of Fixed Abrasive Pads with a Nano-Sized Diamond for Silicon Wafer Polishing

Effect of Process Parameters on the Roughness and Wetting Characteristics of SS304 Surfaces Using Electrolytic and Plasma Electrolytic Polishing Techniques

Effect of process parameters on surface roughness of NiCu alloy in fluid jet polishing

Superfinishing Technology Test for Ceramic Cylindrical Rollers

Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy

High efficiency polishing of micro-structured NiP alloy using isotropic electrochemical etching for achieving sub-nanometer roughness

Investigations on flexible pad polishing for nano-finishing of freeform optics mold

Novel surface characteristics observed during grinding of polycrystalline diamond

Effect of Polishing Grits, Temperatures and Selected Activators on Electroless-nickel Deposition on Cast Aluminium Substrates

Effect of slurry composition on the chemical mechanical polishing of thin diamond films

Research on the Grinding Performance of an Electroplated Coarse-Grained Diamond Grinding Wheel by Dressing

Investigation on abrasive wear of electroplated diamond belt in grinding nickel-based superalloys

Mechanism of surface modification on monocrystalline silicon during diamond polishing at nanometric scale

A Systematic Study of the Factors Affecting the Surface Quality of Chemically Vapor-Deposited Diamond during Chemical and Mechanical Polishing

Fundamental Investigation on Nano-Precision Surface Finishing of Electroless Ni–P-plated STAVAX Steel Using Magnetic Compound Fluid Slurry

Precision shaping of nickel micro-mould features via electropolishing: Characterisation of electrolytes from strong to weak acids