Evaluating interfacial bonding quality of multilayered structure based on ultrasonic testing technology
Puxin Li,Xingguo Wang,Xiaogao Li,Guolang Shen,Chengwen Ma,Zhicheng Huang,Shiyu Su
DOI: https://doi.org/10.1088/1361-6501/acdb8e
IF: 2.398
2023-06-06
Measurement Science and Technology
Abstract:An ultrasonic evaluation method of interfacial bonding quality from layered structures is proposed for enhancing the testing accuracy. The ultrasonic reflection and transmission characteristic is theoretically analyzed, which focus on the different quality of the single and double bonding interface with spring-type. The reflection coefficient and transmission coefficient mathematic models, which include multiple parameters, are derived from the transfer matrix. Taking the first, second, and the double bonding interface as the research objects, respectively, two types of resonant frequencies have been presented by numerical solving the model, namely, the first type resonance frequency (RFI) and the second type resonance frequency (RFII). The results show that the interval of the RFI is related to medium thickness of the maximum acoustic impedance. Similarly, the interval of the RFII depends on other layers' thickness. In addition, the transmission coefficient shows a change in different trends with the bonding interface gradually tending to rigid. When the adhesive layer thickness is sufficiently small compared with the wavelength, the reflection coefficient shows many local minima points at a certain frequencies range, the frequency of local minimum point increases with the increase of the stiffness coefficient. The experimental results are in good agreement with the numerical solution results and finite element analysis (FEA) results.
engineering, multidisciplinary,instruments & instrumentation