Influence of powder layer thickness on microstructure and T5 heat treatability of F357 alloy fabricated by laser powder bed fusion process

Chin Chieh Cheng,Zhen Li,Jaskaranpal Singh Dhillon,Pierre Hudon,Mathieu Brochu
DOI: https://doi.org/10.1016/j.jallcom.2023.169633
IF: 6.2
2023-07-05
Journal of Alloys and Compounds
Abstract:Laser powder bed fusion (LPBF) is one of the most widely used additive manufacturing (AM) methods to produce metal parts with new functionalities, but it still suffers from a low built rate. Increasing the powder layer thickness is an efficient way to augment LPBF productivity. The objective of this study is to investigate the influence of the powder layer thickness during the LPBF of F357 alloy on the microstructure and age-hardening response during T5 heat treatment. Scanning electron microscope (SEM) and transmission electron microscope (TEM) observations show that microstructure differences are negligible between samples printed at 30 μm and 50 μm layer thicknesses in the as-built condition. Samples built with both layer thicknesses and subjected to T5 heat treatments at 150 °C, 160 °C, and 170 °C also show similar microstructures and their α-Al cells contain large Si precipitates and small Si clusters and no β’’-Mg2Si precipitates. Therefore, β’’-Mg2Si precipitation hardening is not the dominant mechanism, and strengthening appears to be mainly due to the small Si clusters. With the help of the Johnson-Mehl-Avrami (JMA) model, the activation energy of the precipitation process of the samples built at 30 and 50 μm layer thicknesses is calculated to be 142 kJ/mol and 139 kJ/mol, respectively. These comparable values suggest a similar evolution of the precipitation hardening for both layer thicknesses, which is consistent with the observed microstructures. Consequently, the production efficiency of LPBF-printed F357 alloys can be enhanced by using higher layer thickness and the T5 heat treatment.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
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